Boeing, Intel Collaborate on Advanced Microelectronics for Aerospace

In a new strategic collaboration, Boeing and Intel are working together to advance semiconductor technology across the aerospace industry, with the intent to create next-generation microelectronics applications in artificial intelligence, secure computing and advanced flight capabilities for future products. 

This collaboration is expected to accelerate progress on key pillars within Boeing’s vision for the future of aerospace, with a focus on technologies that are producible, digital, autonomous and sustainable.

The companies will assess far-ranging microelectronics applications, which will include the cooperative design, development and manufacturing of foundational semiconductors, and the advancement of advanced flight capabilities and high-performance edge-computing solutions.

Boeing will collaborate with Intel to leverage Intel 18A technology, a state-of-the-art Si CMOS (Silicon Complementary Metal-Oxide Semiconductor) fabrication process and other technologies, to create next-generation capabilities relevant to national security.

Other benefits to Boeing related to microelectronics are expected to include process improvements, reducing the time and cost of moving design ideas to commercialization, and developing technical talent.


About Intel Corporation

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California.

It is one of the world’s largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers.

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